| 电源功率半导体器件的热设计 |
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| 引用本文： | 刘远福.电源功率半导体器件的热设计[J].通信电源技术,2006,23(3):51-52. |
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| 作者姓名： | 刘远福 |
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| 作者单位： | 北京交通大学电气工程系,北京,100000 |
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| 摘 要： | 功率半导体器件广泛应用于各种电源设备中。实践表明,功率半导体器件过热损毁是造成电源失效的主要原因之一,因此必须进行良好的热设计以提高电源的可靠性。文章根据功率半导体器件的特点,结合传热学的相关理论,讨论了在电源设备中如何进行功率半导体器件的热设计,给出了热阻计算的经验公式,对功率半导体器件的热设计具有指导作用。
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| 关 键 词： | 电源 功率半导体器件 热设计 |
| 文章编号： | 1009-3664(2006)03-0051-02 |
| 修稿时间： | 2006年3月6日 |
Heat Design of Power Semiconductor |
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| LIU Yuan-fu.Heat Design of Power Semiconductor[J].Telecom Power Technologies,2006,23(3):51-52. |
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| Authors: | LIU Yuan-fu |
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| Abstract: | Power semiconductors are windly used in kinds of telecom equipments.The over-heat of power semiconductors is the main reason causing the failure of power supply,so it is necessary to well process heat design to enhance the reliability of power supply.Based on the characteristics of power semiconductors and combined with related theories of Diathermancy,the article discusses how to process the heat design of power semiconductors on power supply equipment and gives experience formula on heat resistance calculation.It has instruction effect on heat design of power semiconductors. |
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| Keywords: | power suuply power semiconductors heat design |
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