A comparative study of the electrochemical deposition of molybdenum oxides thin films on copper and platinum |
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Authors: | Radu Banica Paul Barvinschi Nicolae Vaszilcsin Terezia Nyari |
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Affiliation: | aUniversity “Politehnica” of Timisoara, Piata Victoriei 2, 300006 Timisoara, Romania;bNational Institute for Research and Development in Electrochemistry and Condensed Matter, Str. Plautius Andronescu 1, 300224 Timisoara, Romania;cWest University of Timisoara, Bd. V. Parvan 4, 300223 Timisoara, Romania |
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Abstract: | Molybdenum oxides thin films electrochemical deposition was performed using solutions of peroxo-polymolybdate at pH 2.3 and ammonium molybdate at pH 5.5 as precursors and smooth copper and platinum as supports. The deposition has been carried out at constant potentials in the range of −600 to −800 mV vs. Ag/AgCl (sat. KCl). The thin films deposited on copper were then heated at 350 and 450 °C in argon. In the case of thin films deposited from ammonium molybdate and heated at 450 °C, the XRD spectra reveal, along with MoO2, the presence of Cu6Mo5O18 phase. For the thin films prepared from peroxo-polymolybdate and subjected to the same heat treatment, the only XRD phase present was MoO2. Thermogravimetric (TG) analysis was performed on samples prepared by scraping away the thin films (molybdate precursors) from the copper support. Before heat treatment, the AFM images of the as-deposited thin film reveal a granular morphology, with diameters in the 20–80 nm range. |
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Keywords: | Electrochemical reactions Thin films Atomic Force Microscopy— AFM |
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