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应用红外热像技术测量电子元件正常工作条件下的表面温度
引用本文:杨晶,M.Behnia,G.Morrison.应用红外热像技术测量电子元件正常工作条件下的表面温度[J].红外技术,2002,24(3):44-48.
作者姓名:杨晶  M.Behnia  G.Morrison
作者单位:1. 北京科技大学,机械工程学院,北京,100083
2. 新南威尔士大学,机械与制造工程学院,澳大利亚
摘    要:由于电子元件的功率密度不断增加,电子产品的热控制日显重要.红外热像仪有众多优点且可用于电子元件表面温度的测量.探讨了如何在电子元件正常工作条件下,应用红外热像仪获得其真实表面温度,涉及背景温度、目标温度的正确估计,透明材料的选取、透射率的估算,误差及可能的修正方法.

关 键 词:红外热像  温度测量  电子元件冷却
文章编号:1001-8891(2002)03-0044-05
修稿时间:2001年9月10日

Application of Infrared Thermography in Surface Temperature Measurement of Electronic Devices at Normal Operating Conditions
M.Behnia,G.Morrison.Application of Infrared Thermography in Surface Temperature Measurement of Electronic Devices at Normal Operating Conditions[J].Infrared Technology,2002,24(3):44-48.
Authors:MBehnia  GMorrison
Abstract:Thermal control of electronic products has become essential, mainly because of increasing power densities of modern electronic components. Infrared thermography (IRCON Camera) has a great amount of advantages as a tool to measure the true surface temperature of electronic devices. This paper discusses how to measure the true temperature of the components by using Infrared Camera without disturbing their normal operating conditions, which involved with estimating target temperature, background temperature correctly and choosing infrared transparent material and its transmission estimation. Measurement errors and their possible remedies are also discussed.
Keywords:infrared thermography  temperature measurement  electronic cooling  
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