基于流固耦合的弹载电子设备瞬态热仿真分析方法

在导弹飞行过程中由于工况环境剧烈变化，其整流罩蒙皮温度和热载荷急剧变化，这将对导弹的作战性能产生重大影响。为保证弹载电子设备的设计满足精度要求，提出了一种基于流固耦合非定常数值模拟的设计计算方法。针对弹载电子设备在高速运行过程中的瞬态热载荷是一个典型流固耦合问题，通过求解流体与固体表面的热传递方程，计算获得流场内各点的能量分段函数。运用MATLAB软件计算拟合出流场每块结构微元对应的瞬态功率曲线分段函数，采用将功率曲线分段函数加载至Fluent的热仿真分析方法，直观预测整个弹载电子设备的工作温度及其环境温度的瞬态变化。通过对某型号反辐射导引头及其弹载电子设备气动加热问题进行具体计算分析，获得了该型号装备在各个时刻流场内导引头及其弹载电子设备的瞬态温度空间分布，所得结果与实际有较好的吻合度。结果表明该方法对同类电子设备的瞬态热分析和相应散热设计具有一定参考作用。

Transient thermal simulation analysis method of missile-borne electronic equipment based on fluid-solid coupling

Due to the dramatic changes during the course of missile fight, the temperature and thermal load of fairing skin have a rapid change, and that will bring a great influence on the operational performance of the missile. To ensure the design accuracy of the electronic device, a design calculation method based on the fluid-solid coupling nonstationary numerical simulation was proposed. Meanwhile, by solving the heat transfer equation of the fluid and the solid surface, the energy piecewise function of each point in the flow field was obtained. The piecewise function of transient power curve corresponding to each structure microelement of flow field was calculated by MATLAB software, and the Fluent thermal simulation analysis method was used to predict the transient variation of working temperature and ambient temperature of the whole missile-borne electronic equipment intuitively through the power curve piecewise function. By the study of aerodynamic heating problem of a type of anti-radiation seeker and its missile-borne electronic equipment, the space distribution of transient thermal every moment in the flow field of the seeker and its missile-borne electronic equipment was calculated, and the obtained results were in good agreement with the practice. The results show that the method has a certain reference for transient thermal analysis and corresponding heat dissipation design of similar electronic devices.