| FBG传感器封装技术的进展 |
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| 引用本文： | 雷飞鹏,宁提纲,周倩,曹毅,毕重颖,王惠.FBG传感器封装技术的进展[J].光纤与电缆及其应用技术,2010(3):1-4,15. |
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| 作者姓名： | 雷飞鹏 宁提纲 周倩 曹毅 毕重颖 王惠 |
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| 作者单位： | 北京交通大学光波技术研究所,北京100044 |
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| 基金项目： | 国家自然科学基金资助项目（60837002） |
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| 摘 要： | 分析了Bragg光纤光栅（FBG）传感器的特点、基本原理以及一些常用的封装方法,并从封装结构、所选材料以及黏结剂三个不同的角度总结了最近几年来FBG传感器封装的进展情况,阐述了各种方法的机理、实验装置和研究结果,并进行了对比分析。
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| 关 键 词： | Bragg光纤光栅传感器 封装材料 黏结剂 封装结构 |
The Progress in FBG Sensor Packaging |
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| LEI Fei-peng,NING Ti-gang,ZHOU Qian,CAO Yi,BI Chong-ying,WANG Hui.The Progress in FBG Sensor Packaging[J].Optical Fiber & Electric Cable and Their Applications,2010(3):1-4,15. |
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| Authors: | LEI Fei-peng NING Ti-gang ZHOU Qian CAO Yi BI Chong-ying WANG Hui |
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| Affiliation: | (Institute of Lightwave Technology,Beijing Jiaotong University,Beijing 100044,China) |
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| Abstract: | The characteristics and fundamental principles of FBG sensors and some common used packaging methods are analyzed.The evolution of FBG sensors in recent years are summarized from three aspects： packaging structure,materials used,and adhesives.In addition the mechanism,experiment set-up,and research results of various methods are described,finally,comparison among them is made. |
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| Keywords: | FBG sensor packaging material adhesive packaging structure |
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