| 化学镀镍金层可焊性的影响因素 |
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| 引用本文： | 史筱超,崔艳娜,贺岩峰,郁祖湛.化学镀镍金层可焊性的影响因素[J].印制电路信息,2006(4):40-43. |
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| 作者姓名： | 史筱超 崔艳娜 贺岩峰 郁祖湛 |
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| 作者单位： | 1. 长春工业大学化工学院,130012
2. 复旦大学化学系,200433 |
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| 摘 要： | 我们将国内外报道化学镀镍金的部分最新研究成果,同我们实验室的实践相结合,对造成化学镀镍金可焊性差的多种因素作一简要介绍。本文总结了影响化学镀镍金可焊性的复杂因素如:前处理的影响、化学镀镍过程的影响、浸金的影响、浸金后水洗的影响、焊料的影响。
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| 关 键 词： | 化学镀镍 浸金 可焊性 |
Factors Influencing the Solderability of Electro Less Nickel and Immersion Gold Layer |
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| Shi Xiaochao,Cui Yanna,He Yanfeng,Yu Zuzhan.Factors Influencing the Solderability of Electro Less Nickel and Immersion Gold Layer[J].Printed Circuit Information,2006(4):40-43. |
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| Authors: | Shi Xiaochao Cui Yanna He Yanfeng Yu Zuzhan |
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| Affiliation: | Shi Xiaochao Cui Yanna He Yanfeng Yu Zuzhan |
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| Abstract: | Based on the domestic and foreign reports, we combine part of the newest research achievements withour laboratory practice. Factors influencing the solder ability of electro less nickel and immersion gold layer were brieflyintroduced. This paper servers as a summary review of the complex factors such as the prepare, the process of electroless nickel, immersion gold, the rinse after immersion gold, the solder. |
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| Keywords: | electro less nickel immersion gold solderability |
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