| Sn-Ag-Cu无铅焊料的可靠性研究 |
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| 引用本文： | 韩永典,荆洪阳,徐连勇,郭伟杰,王忠星. Sn-Ag-Cu无铅焊料的可靠性研究[J]. 电子与封装, 2007, 7(3): 4-6,33 |
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| 作者姓名： | 韩永典 荆洪阳 徐连勇 郭伟杰 王忠星 |
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| 作者单位： | 天津大学材料科学与工程学院,天津,300072;巴特勒(天津)有限公司,天津,300457 |
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| 摘 要： | 欧盟对电子产品的RoHS法令的实施加快了电子封装钎焊无铅化的步伐。Sn-Ag-Cu焊料以其优良的机械性能和可焊性,逐渐得到了国际社会的认可。文章对无铅焊料的发展过程,Sn-Ag-Cu合金的性能进行了综述,重点介绍了Sn-Ag-Cu焊点的可靠性,包括试验法和有限元法。最后对Sn-Ag-Cu焊料的应用前景进行了展望。
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| 关 键 词： | 无铅焊料 Sn-Ag-Cu 可靠性 有限元法 |
| 文章编号： | 1681-1070（2007）03-0004-03 |
| 收稿时间： | 2006-11-24 |
| 修稿时间： | 2006-11-24 |
Study on the Reliability of Sn-Ag-Cu Lead-free Solders |
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| HAN Yong-dian,JING Hong-yang,XU Lian-yong,GUO Wei-jie,WANG Zhong-xing. Study on the Reliability of Sn-Ag-Cu Lead-free Solders[J]. Electronics & Packaging, 2007, 7(3): 4-6,33 |
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| Authors: | HAN Yong-dian JING Hong-yang XU Lian-yong GUO Wei-jie WANG Zhong-xing |
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| Abstract: | RoHS law endorsed by EU on electronic products quickens the tendency of lead-free solders. Because of their excellent mechanical properties and solderability, Sn-Ag-Cu solders are widely used in the world. In this paper, the developing process of lead-free solders and properties of Sn-Ag-Cu alloy are explained. Meanwhile, the reliability of Sn-Ag-Cu solders including experimental and finite element method is focused on. At last, Sn- Ag-Cu solders’ application in the future is expected. |
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| Keywords: | lead-free Sn-Ag-Cu reliability finite element method |
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