| QFN封装元件组装工艺技术研究 |
| |
| 引用本文： | 鲜飞. QFN封装元件组装工艺技术研究[J]. 电子元件与材料, 2005, 24(11): 52-55 |
| |
| 作者姓名： | 鲜飞 |
| |
| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
| |
| 摘 要： | QFN是一种焊盘尺寸小、体积小、以塑料作为密封材料的新兴的表面贴装芯片封装技术。由于底部中央的大暴露焊盘被焊接到PCB的散热焊盘上,这使得QFN具有极佳的电和热性能。QFN封装尺寸较小,有许多专门的焊接注意事项。介绍了QFN的特点、分类、工艺要点和返修。
|
| 关 键 词： | 电子技术 方形扁平无引脚封装 印刷线路板 焊盘 网板 |
| 文章编号： | 1001-2028（2005）11-0052-04 |
| 收稿时间： | 2005-06-24 |
| 修稿时间： | 2005-06-24 |
Research on QFN Soldering and Assembly |
| |
| XIAN Fei. Research on QFN Soldering and Assembly[J]. Electronic Components & Materials, 2005, 24(11): 52-55 |
| |
| Authors: | XIAN Fei |
| |
| Affiliation: | Fiberhome Telecommunication Co., Ltd, Wuhan 430074, China |
| |
| Abstract: | The QFN package(Quad Flat No-lead Package),a new and developing technology for chip package,is a small footprint,low profile,surface mount,plastic encapsulated package with leads on the bottom.QFN packages achieve maximum thermal and electrical performance only if the die pad is soldered the PCB thermal pad.Due to their small size,QFN packages have special soldering considerations.The things of QFN’s characteristics,division,technical gist and rework are described. |
| |
| Keywords: | electronic technology QFN PCB footprint stencil |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
