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Four different approaches for the measurement of IC surface temperature: application to thermal testing |
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| Authors: | Josep AltetSebastian Volz Jean-Michel RampnouxAntonio Rubio Stephane GraubyLuis David Patino Lopez Wilfrid ClaeysJean-Bernard Saulnier |
| Affiliation: | a Department of Electronic Engineering, UPC, Campus Nord, Building C4, 08034 Barcelona, Spain b Centre de Physique Moléculaire Optique et Hertzienne, CPMOH, University of Bordeaux I, 352 Cours de la libération, 33405 Talence Cedex, France c Laboratoire d'Etudes Thermiques, Ecole Nationale Superieur de Mechanique et d'Aerotechnique, LET-ENSMA-BP, 109-86960 Futuroscope Cedex, France |
| Abstract: | Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC. |
| Keywords: | Thermal testing Scanning thermal microscopy Laser reflectometry Laser interferometry Built-in temperature sensors Thermal couplings Integrated circuits |
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