| 活性法陶瓷-金属封接工艺的新进展 |
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| 引用本文： | 高陇桥. 活性法陶瓷-金属封接工艺的新进展[J]. 真空电子技术, 2006, 0(4): 62-65 |
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| 作者姓名： | 高陇桥 |
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| 作者单位： | 北京真空电子技术研究所,北京,100016 |
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| 摘 要： | 综述了活性法陶瓷-金属封接工艺的新进展，强调指出：返烧经研磨的瓷件，用活性法同样可以得到高质量的陶瓷-金属封接件。
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| 关 键 词： | 陶瓷-金属封接 活性法 新进展 质量 再烧结 |
| 文章编号： | 1002-8935(2006)04-0062-04 |
| 收稿时间： | 2006-03-11 |
| 修稿时间： | 2006-03-11 |
Recent Advances of Ceramic to Metal Seal with Active Methods |
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| GAO Long-qiao. Recent Advances of Ceramic to Metal Seal with Active Methods[J]. Vacuum Electronics, 2006, 0(4): 62-65 |
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| Authors: | GAO Long-qiao |
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| Affiliation: | Beijing Vacuum Electronics Research Institute, Beijing 100016, China |
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| Abstract: | Recent advanccs of ceramic to metal seal with active metal methods are reviewed in this paper. It puts emphasis on that a good seal quality can also be obtained by active process, if ceramics has been resintering after grinding. |
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| Keywords: | Ceramic to metal seal Active method process New progress Quality Resintering |
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