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Development of substrate-pumped nMOS protection for a 0.13 μm technology
Authors:Craig Salling  Jerry Hu  Jeff Wu  Charvaka Duvvury  Roger Cline  Rith Pok
Abstract:A methodology is presented for improved process and circuit development of substrate-pumped nMOS protection. ESD process development is accelerated by applying factor analysis to completed non-ESD experiments. Factor analysis is complemented by a straightforward diagnosis of nMOS snapback. This approach enabled verification of two process solutions, including a novel method, in one fab cycle-time. HBM data that shows the substrate-pumped nMOS can provide dramatically higher protection than estimated from conventional It2 measurements. This motivates improved ESD circuit development. The nMOS clamp transistor is characterized as an actively biased LNPN, which is how it is used in a substrate-pumped protection circuit. A systematic approach to circuit development is described that is based upon empirical characterization of well-defined circuit components under conditions approximating ESD.
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