Evaluation of solder joint reliability in flip-chip packages during accelerated testing |
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Authors: | Jong-Woong Kim Dae-Gon Kim Won Sik Hong Seung-Boo Jung |
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Affiliation: | (1) Department of Advanced Materials Engineering, Sungkyunkwan University, 440-746 Gyeonggi-do, Korea;(2) Reliability and Failure Analysis Center, Korea Electronics Technology Institute, 451-865 Gyeonggi-do, Korea;(3) Department of Materials Engineering, Hankuk Aviation University, 412-791 Gyeonggi-do, Korea |
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Abstract: | The microstructural investigation and thermomechanical reliability evaluation of the Sn-3.0Ag-0.5Cu solder bumped flip-chip
package were carried out during the thermal shock test of the package. In the initial reaction, the reaction product between
the solder and Cu mini bump of chip side was Cu6Sn5 intermetallic compound (IMC) layer, while the two phases which were (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were formed between the solder and electroless Ni-P layer of the package side. The cracks occurred at the corner solder joints
after the thermal shocks of 400 cycles. The primary failure mechanism of the solder joints in this type of package was confirmed
to be thermally-activated solder fatigue failure. The premature brittle interfacial failure sometimes occurred in the package
side, but nearly all of the failed packages showed the occurrence of the typical fatigue cracks. The finite-element analyses
were conducted to interpret the failure mechanisms of the packages, and revealed that the cracks were induced by the accumulation
of the plastic work and viscoplastic shear strains. |
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Keywords: | Flip chip reliability finite-element analysis fatigue Sn-3 0Ag-0 5Cu |
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