无铅软钎料国内外的研究动态与发展趋势

全球禁铅运动的发展使得无铅技术已提上各国议事日程，针对这一形势，笔者概述了近几年来国内外无铅焊接的研究动态与发展趋势，特别介绍了无铅钎焊的软钎料开发的最新研究成果，并指出了该领域中值得关注的Sn—Ag与Sn—Zn系钎料的开发价值与应用前景．同时指出添加微量合金和稀土元素对无铅软钎料开发的意义。国内应重视这一领域的研究，争取在该领域的主动地位。

Research and development trend of lead-free solder alloy at home and abroad

With the prohibition of using lead solder, the lead-free technology has been put on the agenda in many nations. The paper summarizes the recent research and development trend of this field at home and abroad , especially the last results of lead-free solders. Attention should be paid to the research and application of Sn-Zn and Sn-Ag based solders, and the value of adding microalloy and rare-earth elements to the lead-free solders as well.