Indium bump array fabrication on small CMOS circuit for flip-chip bonding |
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Authors: | Huang Yuyang Zhang Yuxiang Yin Zhizhen Cui Guoxin Liu H C Bian Lifeng Yang Hui Zhang Yaohui |
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Affiliation: | 1. Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215125, China 2. Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215125, China;Institute for Microstructural Sciences, National Research Council, Ottawa K1A 0R6, Canada |
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Abstract: | We demonstrate a novel method for indium bump fabrication on a small CMOS circuit chip that is to be flip-chip bonded with a GaAs/AlGaAs multiple quantum well spatial light modulator.A chip holder with a via hole is used to coat the photoresist for indium bump lift-off.The 1000 μm-wide photoresist edge bead around the circuit chip can be reduced to less than 500μm,which ensures the integrity of the indium bump array.64 × 64 indium arrays with 20 μm-high,30 μm-diameter bumps are successfully formed on a 5 × 6.5 mm2 CMOS chip. |
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Keywords: | flip-chip bonding indium bump array small-size |
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