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Reliability analysis for thermal cutting method based non-explosive separation device
Authors:Junwoo Choi  Kukha Hwang  Byungkyu Kim
Affiliation:1.Department of Aerospace and Mechanical Engineering, Graduate School,Korea Aerospace University,Goyang-si, Gyeonggi-do,Korea;2.School of Aerospace and Mechanical Engineering,Korea Aerospace University,Goyang-si, Gyeonggi-do,Korea
Abstract:In order to increase the reliability of a separation device for a small satellite, a new non-explosive separation device is invented. This device is activated using a thermal cutting method with a Ni-Cr wire. A reliability analysis is carried out for the proposed non-explosive separation device by applying the Fault tree analysis (FTA) method. In the FTA results for the separation device, only ten single-point failure modes are found. The reliability modeling and analysis for the device are performed considering failure of the power supply, the Ni-Cr wire burns failure and unwinds, the holder separation failure, the balls separation failure, and the pin release failure. Ultimately, the reliability of the proposed device is calculated as 0.999989 with five Ni-Cr wire coils.
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