| 化学沉积Ni-P及Ni-Cu-P合金镀层晶化行为的比较 |
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| 引用本文： | 于会生,罗守福,王永瑞.化学沉积Ni-P及Ni-Cu-P合金镀层晶化行为的比较[J].材料工程,2002(4):19-23. |
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| 作者姓名： | 于会生 罗守福 王永瑞 |
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| 作者单位： | 上海交通大学材料科学与工程学院,上海,200030 |
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| 基金项目： | 国家九五科学仪器科技攻关资助项目 (96-A2 3 -0 2 -17) |
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| 摘 要： | 利用DSC和XRD对化学沉积Ni-P及Ni-Cu-P合金镀层的晶化行为进行了比较研究，结果表明：低磷Ni-P镀层直接转变为稳定相Ni3P,而低磷（高铜）Ni-Cu-P镀层则经生成亚稳中间相Ni5P2后再向稳定相Ni3P转变，高磷非晶态Ni-12.1%P(质量分数，下同）和Ni-17.96%Cu-9.29%P合金镀层均先形成亚稳中间相Ni5P2和Ni12P5后，再转变为稳定相Ni3P,但Ni-Cu-P合金镀层转变为亚稳相的温度比Ni-P镀层的高。
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| 关 键 词： | 合金镀层 晶化行为 化学沉积 Ni－P Ni－Cu－P 钢基体 |
| 文章编号： | 1001-4381(2002)04-0019-05 |
| 修稿时间： | 2001年3月10日 |
The Comparisons of the Crystallization Behaviors of Electroless Ni-P and Ni-Cu-P Deposits |
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| YU Hui sheng,LUO Shou fu,WANG Yong rui.The Comparisons of the Crystallization Behaviors of Electroless Ni-P and Ni-Cu-P Deposits[J].Journal of Materials Engineering,2002(4):19-23. |
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| Authors: | YU Hui sheng LUO Shou fu WANG Yong rui |
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| Abstract: | The crystallization behavior of electroless Ni P and Ni Cu P was studied contrastively by using DSC and XRD The results show that low P Ni P deposits transform to the stable phase Ni 3P directly, but Ni Cu P deposits with low phosphorus content (high copper content) transform to the metastable phase Ni 5P 2 first, and then to the stable phase Ni 3P Both the amorphous Ni 12 1%P(mass fraction) and Ni 17 96%Cu 9 29%P deposits with high phosphorus content transform to the metastable phases Ni 5P 2 and Ni 12 P 5 first, then to the stable phase Ni 3P, but the temperatures of Ni Cu P deposits transforming to metastable phases are higher than that of Ni P deposits |
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| Keywords: | electroless Ni P Ni Cu P crystallization metastable phase |
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