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无溶剂型湿固化异氰酸酯树脂胶粘剂的研制
引用本文:李海英,顾继友,黄元波.无溶剂型湿固化异氰酸酯树脂胶粘剂的研制[J].中国胶粘剂,2006,15(4):28-30,33.
作者姓名:李海英  顾继友  黄元波
作者单位:东北林业大学,黑龙江省,哈尔滨市,150040
摘    要:研究在单组分湿固化溶剂型异氰酸酯胶粘剂制备的基础上,通过调节溶剂、增塑剂、降粘剂的用量及PAPI与TDI比例,探索其制备工艺。实验证明,用增塑剂、降粘剂代替溶剂是可行的。最终优化得到的无溶剂型湿固化异氰酸酯胶粘剂的配方组成为:增塑剂15%,降粘剂5%,PAPI与TDI摩尔比为4:1。

关 键 词:无溶剂  湿固化  异氰酸酯树脂  胶粘剂
文章编号:1004-2849(2006)04-0028-04
收稿时间:2005-11-04
修稿时间:2005-11-042005-12-20

Preparation of moisture curing solventless isocyanate adhesive
LI Hai-ying,GU Ji-you,HUANG Yuan-bo.Preparation of moisture curing solventless isocyanate adhesive[J].China Adhesives,2006,15(4):28-30,33.
Authors:LI Hai-ying  GU Ji-you  HUANG Yuan-bo
Affiliation:Northeast Forestry University,haerbin 150040,China
Abstract:To adjuste the dosages of solvent,plasticizer,viscosity reducer and ratio PAPI to TDI, the preparation process of moisture curing solventless isocyannate adhesive was studied in this paper. The experiments showed that using plasticizer and viscosity reducer taken place of the solvent are feasible. The moisture curing solventless isocyanate adhesive was prepared form 15% plasiticizer,5% viscosity decrease , molar ratio of PAPI to TDI was 4:1.
Keywords:solventless  moisture curing  isocyanate resin  adhesive
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