| PCB镀通孔发生“空洞”的根本原因和对策 |
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| 引用本文： | 林金堵,吴梅珠. PCB镀通孔发生“空洞”的根本原因和对策[J]. 印制电路信息, 2010, 0(4): 31-36 |
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| 作者姓名： | 林金堵 吴梅珠 |
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| 作者单位： | |
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| 摘 要： | 文章概述了多层板镀通孔发生“空洞”的根本原因与对策。基材、钻孔、孔壁粗糙度、孔尺寸、化学镀铜和电镀铜等都会影响PTH的“空洞”问题。
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| 关 键 词： | 镀通孔 镀层“空洞” 镀层附着力 高性能基材 孔壁表面状态 化学镀铜 |
The Basic and Countermeasure of the Plated Through Hole Voiding in PCB |
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| LIN Jin-du WU Mei-zhu. The Basic and Countermeasure of the Plated Through Hole Voiding in PCB[J]. Printed Circuit Information, 2010, 0(4): 31-36 |
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| Authors: | LIN Jin-du WU Mei-zhu |
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| Abstract: | The paper describes the basic and countermeasure of the plated through hole voiding in PCB.The substrate material,drilling hole,hole-wall topography,hole size,electroless copper,and plated copper can significantly impact the hole-wall voids,adhesion,and reliability of the PTH. |
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| Keywords: | PTH(Plated Through-Hole) hole-wall voids hole-wall adhesion high-performance substrate hole-wall topography electroless copper |
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