Role of nano‐size SiO2 additive on the thermal behavior of cyanoacrylate nanocomposite |
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| Authors: | Amir Yaghmaei Mehrdad Kashefi Torbati Seyyed Mojtaba Zebarjad |
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| Affiliation: | Department of Materials Science and Metallurgical Engineering, Faculty of Engineering, Ferdowsi University of Mashhad, Mashhad, Iran |
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| Abstract: | Nowadays, solvent‐free, one‐part cyanoacrylate adhesive is widely used in medicine and dentistry. According to a literature survey done by the authors, there are few papers concentrated on the role of nano‐sized particles on the thermal behavior of cyanoacrylate glue. Thus the main goal of the current research focused on clarifying the role of nano‐sized SiO2 on the thermal behavior of cyanoacrylate. Thermal behavior of all materials including cyanoacrylate and its nanocomposites was studied by using Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) methods. The results of DSC analysis showed that an increase in the amount of nano‐sized SiO2 results in decreases in the duration of cyanoacrylate curing, energy release during polymerization, and incubation time of polymerization. Furthermore, the results of TGA tests illustrated that the weight loss of cyanoacrylate strongly depends on the contents of both caffeine and SiO2. In fact, an increase in nano‐sized SiO2 content increases the degradation temperature of cyanoacrylate. J. VINYL ADDIT. TECHNOL., 2010. © 2010 Society of Plastics Engineers |
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