Review of Capabilities of the ENEPIG Surface Finish |
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| Authors: | Menahem Ratzker Adam Pearl Michael Osterman Michael Pecht George Milad |
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| Affiliation: | 1. Center for Advanced Life Cycle Engineering, University of Maryland, College Park, MD, 20742, USA
2. Uyemura International Corporation, Southington, CT, 06489, USA
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| Abstract: | Surface finishes are used to protect exposed copper metallization in printed circuit boards from oxidation and to provide a solderable surface on which to mount electronic components. While it is true that some people have called electroless nickel electroless palladium immersion gold (ENEPIG) a “universal finish” for a wide range of applications from wire bonding to solder interconnects, this paper provides a review of the current literature on ENEPIG and assesses its overall capabilities compared to other surface finishes. Gaps in understanding the performance of ENEPIG as a printed wiring board surface finish are identified and further testing is recommended. |
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