Investigation of the Growth of Intermetallic Compounds Between Cu Pillars and Solder Caps

In flip chip applications, Cu pillars with solder caps are regarded as next-generation electronic interconnection technology, because of high input/output density. However, because of diffusion and reaction of Sn and Cu during the high-temperature reflow process, intermetallic compounds (IMC) are formed, and grow, at the interface between the cap and the pillar. Understanding the growth behavior of interfacial IMC is critical in the design of solder interconnections, because excessive growth of IMC can reduce the reliability of connections. In this study, the growth of IMC during thermal cycling, an accelerated method of testing the service environment of electronic devices, was studied by use of focused ion beam–scanning electron microscopy. Under alternating high and low-temperature extremes, growth of Cu₆Sn₅ (η-phase) and Cu₃Sn (ε-phase) IMC was imaged and measured as a function of the number of cycles. The total IMC layer grew significantly thicker but became more uniform during thermal cycling. The Cu₃Sn layer was initially thinner than the Cu₆Sn₅ layer but outgrew the Cu₆Sn₅ layer after 1000 cycles. It was found that, with limited Cu and Sn diffusion, consumption of Cu₆Sn₅ for growth of the Cu₃Sn layer can result in a thinner Cu₆Sn₅ layer after thermal cycling.