半导体器件和集成电路封装的发展趋势

随着表面安装技术(SMT)的迅速发展,电子元器件正在朝着片式化、编带化方面发展。本文仅就表面安装器件(SMD)及IC封装的目前状况以及涉及到的封装的新工艺、新材料的未来发展作了详细报导。尤其对高可靠、高密度多层陶瓷封装技术以及新型陶瓷材料作了详细评述,并对今后我所封装方面的研制、开发工作提出了建议和设想。

Trend of Packages for Semiconductor Devices and IC's

With the development of SMT, the electronic components and devices are trending towards Chip part and surface-mount tapes. This paper describes the current state, the new materiats and the new technotogy for SMD and IC packages in detail. Especially, the technology of high reliability, high density multilayer ceramic package and new ceramic materials are reviewed. In addition, the author also offers some suggestions on the future packaging development in our institute.