一种用于微惯性组合的新型微封装技术

针对近年来惯性类组合产品朝微型化发展趋势,设计了一种新型的微型惯性组合封装技术。介绍了该技术所涉及装置的构成及封装过程,专门设计了相应的挤压头,并对影响最终铆封接头成型的挤压量做了精心设计。将应用该技术后的产品进行了振动冲击试验和有限元仿真分析。结果表明,振动冲击后的产品铆封接头没有失效情况出现;而有限元分析结果显示,铆封接头边缘的最大位移值为0.01 mm。由此判定铆封接头牢固可靠。这种微型化封装技术不仅应用于惯性组合,同样也适用于其他行业的产品,有很高的推广价值。

A Novel Miniaturized Packaging Technology for Miniature Inertia Integrated Navigation System

Aiming at the trend of miniaturization of inertial integrated navigation system in recent years, a novel miniaturized packaging technology for the miniature inertial integrated navigation system is designed in this paper. The device structure and packaging process involved in this technology are introduced. The corresponding extrusion heads have been specially designed, and the amount of extrusion that affects the final riveted joints has been carefully designed. The vibration impact test and finite element simulation analysis were carried out for the product after applying this technology. The results show that there is no failure of the riveted joint after vibration impact, and the results of finite element analysis show that the maximum displacement of the riveted joint edge is 0.01 mm, which determines that the riveted joint is firm and reliable. This miniaturized packaging technology is not only applied to inertial integrated products, but also applicable to products in other industries, and has high promotion value.