0.1-μm p+-GaAs gate HJFET's fabricated using two-stepdry-etching and selective MOMBE growth techniques |
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Authors: | Wada S Furuhata N Tokushima M Fukaishi M Hida H Maeda T |
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Affiliation: | Opto-Electron. Res. Labs., NEC Corp., Ibaraki; |
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Abstract: | This paper reports the first successful fabrication of high-performance, 0.1-μm p+-gate pseudomorphic heterojunction-FET's (HJFET's). By introducing the two-step dry-etching technique which compensates for the poor dry-etching resistance of PMMA, 0.1-μm or less gate-openings with a high aspect-ratio of 3.5 in SiO 2 film are achieved. In addition, by using the gate electrode filling technique with selective MOMBE p+-GaAs growth, 0.1-μm voidless p+-GaAs gate electrodes with a high aspect-ratio are achieved for the first time. The fabrication technology leads to a reduction of external gate fringing capacitance (Ceext f) in a T-shaped gate-structure and an improvement in gate turn-on voltage. The fabricated 0.1-μm, T-shaped, p+-gate n-Al0.2Ga0.8As/In0.25Ga0.75 As HJFET exhibits a high gate turn-on voltage (Vf) of about 0.9 V, and a good gmmax of 435 mS/mm. Also, an excellent microwave performance of fT=121 GHz and fmax =144 GHz is achieved due to the Cextf reduction. The technology and device show great promise for future high-speed applications, such as in power devices, MMIC's, and digital IC's |
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