| 表面组装印制电路板的可制造性设计 |
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| 引用本文： | 梁万雷,曹白杨. 表面组装印制电路板的可制造性设计[J]. 电子工艺技术, 2008, 29(2): 74-77 |
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| 作者姓名： | 梁万雷 曹白杨 |
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| 作者单位： | 北华航天工业学院,河北,廊坊,065000;北华航天工业学院,河北,廊坊,065000 |
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| 摘 要： | 表面组装印制电路板的可制造性设计主要解决电路设计和工艺制造之间的接口问题.可制造性设计具有缩短开发周期、降低成本、提高产品质量等优点,是企业取得成功的有效途径.从介绍表面组装印制电路板常见的不良设计入手,进而分析不良设计产生的原因,最后从设备和工艺两个方面提出可制造性设计的具体要求.
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| 关 键 词： | 表面组装 印制电路板 可制造性设计 |
| 文章编号： | 1001-3474(2008)02-0074-04 |
| 修稿时间： | 2008-01-06 |
DFM of PCB in the Field of SMT |
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| LIANG Wan-lei,CAO Bai-yang. DFM of PCB in the Field of SMT[J]. Electronics Process Technology, 2008, 29(2): 74-77 |
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| Authors: | LIANG Wan-lei CAO Bai-yang |
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| Affiliation: | LIANG Wan-lei,CAO Bai-yang(North China Institute of Aerospace Engineering,Langfang 065000,China) |
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| Abstract: | DFM of PCB in the field of SMT is mainly used to solve the problems between design and manufacture.It's not only good for shortening development cycle,reducing cost and improving quality of the products,but also a good way of enterprise to be successful.Focus the topic of PCB design in the field of SMT,begin from the design mistakes and analyze corresponding reasons,then provide the design requirements of manufacturability from both SMT equipments and technics. |
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| Keywords: | SMT PCB DFM |
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