Pad effects on material-removal rate in chemical-mechanical planarization |
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Authors: | Ashraf Bastawros Abhijit Chandra Yongjin Guo Bo Yan |
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Affiliation: | (1) Department of Aerospace Engineering and Engineering Mechanics, Iowa State University, 50011 Ames, IA;(2) Department of Mechanical Engineering, Iowa State University, USA |
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Abstract: | The role of a porous pad in controlling material-removal rate (MRR) during the chemical-mechanical planarization (CMP) process has been studied numerically. The numerical results are used to develop a phenomenological model that correlates the forces on each individual abrasive particle to the applied nominal pressure. The model provides a physical explanation for the experimentally observed domains of pressure-dependent MRR, where the pad deformation controls the load sharing between active-abrasive particles and direct pad-wafer contact. The predicted correlations between MRR and slurry characteristics, i.e., particle size and concentration, are in agreement with experimentally measured trends reported by Ouma1 and Izumitani.2 |
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Keywords: | Chemical-mechanical planarization material-removal rate porous pad abrasive particle asperity contact |
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