| 电迁移对Sn3.0Ag0.5Cu无铅焊点剪切强度的影响 |
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| 引用本文： | 常红,李明雨. 电迁移对Sn3.0Ag0.5Cu无铅焊点剪切强度的影响[J]. 电子元件与材料, 2011, 30(2): 29-31 |
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| 作者姓名： | 常红 李明雨 |
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| 作者单位： | 哈尔滨工业大学,深圳研究生院,现代焊接生产技术国家重点实验室,广东,深圳,51805 |
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| 基金项目： | 广东省科技计划资助项目 |
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| 摘 要： | 通过热风回流焊制备了Cu/Sn3.0Ag0.5Cu/Cu对接互连焊点,测试了未通电及6.5 A直流电下通电36 h和48 h后焊点的剪切强度.结果表明,电迁移显著地降低了焊点的剪切强度,电迁移36 h使剪切抗力降低约30%,电迁移48 h降低约50%.SEM观察断口和界面形貌表明,界面金属间化合物增厚使断裂由韧性向脆性...
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| 关 键 词： | 电迁移 剪切强度 Sn3.0Ag0.5Cu |
Influence of electromigration on the shear strength of Sn3.0Ag0.5Cu Pb-free solder joint |
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| CHANG Hong,LI Mingyu. Influence of electromigration on the shear strength of Sn3.0Ag0.5Cu Pb-free solder joint[J]. Electronic Components & Materials, 2011, 30(2): 29-31 |
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| Authors: | CHANG Hong LI Mingyu |
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| Affiliation: | CHANG Hong,LI Mingyu (State Key Lab of Advanced Welding Production Technology,Harbin Institute of Technology Shenzhen Graduate School,Shenzhen 518055,Guangdong Province,China) |
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| Abstract: | The Cu/Sn3.0Ag0.5Cu/Cu solder joints were prepared by hot wind reflow soldering technique.Shear strengths of varied specimens with no current action and current action at 6.5 A for 36 h and 48 h respectively,were tested.Results indicate that electromigration degrades the shear strength of the solder joints seriously.The resist shear forces of the joints reduce about 30% and 50% after current actions for 36 h and 48 h,respectively.It is observed that the transition of the failure mode from ductile to brittle... |
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| Keywords: | Sn3.0Ag0.5Cu |
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