| 低熔点SnBi合金对导电银胶性能的影响 |
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| 引用本文： | 万超,王宏芹,王玲,杜彬,王鹏程,符永高. 低熔点SnBi合金对导电银胶性能的影响[J]. 电子元件与材料, 2011, 30(3): 55-57 |
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| 作者姓名： | 万超 王宏芹 王玲 杜彬 王鹏程 符永高 |
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| 作者单位： | 中国电器科学研究院,广东,广州,510300 |
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| 摘 要： | 以银粉为主要导电填料,选定环氧树脂体系,添加不同量低熔点共晶SnBi合金制得导电胶,利用四点探针法和万能材料试验机考察了SnBi合金添加量对导电胶导电性能和力学性能的影响.发现当SnBi合金添加量占填料质量分数的15%时,导电胶的体积电阻率可以达到3.4×10<,-4>Ω·cm,剪切强度为12.56 MPa.SnBi合...
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| 关 键 词： | 导电银胶 SnBi合金 剪切强度 |
Effect of low melting point eutectic SnBi alloy on properties of Ag-based conductive adhesive |
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| WAN Chao,WANG Hongqin,WANG Ling,DU Bin,WANG Pengcheng,FU Yonggao. Effect of low melting point eutectic SnBi alloy on properties of Ag-based conductive adhesive[J]. Electronic Components & Materials, 2011, 30(3): 55-57 |
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| Authors: | WAN Chao WANG Hongqin WANG Ling DU Bin WANG Pengcheng FU Yonggao |
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| Affiliation: | (China National Electric Apparatus Research Institute,Guangzhou 510300,China) |
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| Abstract: | The conductive adhesives composed by selecting epoxy resin system,Ag powder as main conductive filler with addition different masses of low melting point eutectic SnBi alloy were fabricated and its conductive and mechanical properties were investigated by the four point probe method and the universal material testing machine.It is found that when w(SnBi) keeps at 15%,the bulk resistivity and the shear strength of the adhesive reach 3.4×10-4 Ω·cm and 12.56 MPa,respectively.The addition of SnBi alloy not only improves the conductivity,but also increases the mechanical property of the connection. |
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| Keywords: | conductive adhesive eutectic SnBi alloy shear strength |
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