| 微电子芯片热电冷却系统的传热特性 |
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| 引用本文： | 王长宏,陈颖,朱冬生.微电子芯片热电冷却系统的传热特性[J].电子元件与材料,2011,30(2):57-61. |
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| 作者姓名： | 王长宏 陈颖 朱冬生 |
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| 作者单位： | 王长宏,陈颖,WANG Changhong,CHEN Ying(广东工业大学,材料与能源学院,广东,广州,510006);朱冬生,ZHU Dongsheng(华南理工大学,传热强化与过程节能教育部重点实验室,广东,广州,510640) |
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| 基金项目： | 国家自然科学基金资助项目，广东工业大学博士启动基金资助项目 |
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| 摘 要： | 针对微电子芯片热管理技术的现状和传统冷却技术的不足,建立微电子芯片热电冷却装置及其性能测试系统,采用热阻分析模型对传热过程进行研究.结果表明:在热电冷却过程中,帕尔帖效应占主导作用,TEC(热电冷却系统)自身热阻θ2随工作电流I的增大而降低.当芯片功率为20 W时,芯片与TEC冷面的界面热阻θ1在I为2.1 A时取得最...
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| 关 键 词： | 热电冷却 微电子芯片 传热特性 热阻 |
Heat transfer characteristics analysis on the TEC system of the microelectronic chip |
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| WANG Changhong,CHEN Ying,ZHU Dongsheng.Heat transfer characteristics analysis on the TEC system of the microelectronic chip[J].Electronic Components & Materials,2011,30(2):57-61. |
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| Authors: | WANG Changhong CHEN Ying ZHU Dongsheng |
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| Affiliation: | WANG Changhong1,CHEN Ying1,ZHU Dongsheng2 (1.Faculty of Materials and Energy,Guangdong University of Technology,Guangzhou 510006,China,2.The Key Lab of Enhanced Heat Transfer and Energy Conservation Ministry of Education,South China University of Technology,Guangzhou 510640,China) |
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| Abstract: | Based on the research background and status of the thermal management technology for microelectronic chip,the microelectronic chip thermoelectric cooling equipment and its test system were developed.The thermal resistance analysis model was applied in research of the heat transfer process.The results show that when the thermoelectric cooling system is in normal operating condition,the Peltier effect is the dominant role in the thermoelectric cooling process.The thermal resistance θ2 of TEC decreases when the operating current I increases,the interface thermal resistance θ1 can obtain the minimum value 0.461 ℃·W-1 when the chip power is 20 W and I is 2.1 A.The total thermal resistance θtotal firstly decreases and then increases with the increase of operating current I.θtotal may obtain the minimum value 0.344 ℃·W-1 when the chip power is 20 W and I is 2.1 A.Furthermore,θtotal and optimum operating current both increase as the chip power increases. |
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| Keywords: | thermoelectric cooling microelectronic chip heat transfer characteristics thermal resistance |
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