| SnAgCu无铅焊点原位电迁移IMC演变 |
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| 引用本文： | 常红,李明雨.SnAgCu无铅焊点原位电迁移IMC演变[J].电子元件与材料,2011,30(3):58-60,68. |
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| 作者姓名： | 常红 李明雨 |
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| 作者单位： | 哈尔滨工业大学,深圳研究生院,现代焊接生产技术国家重点实验室,广东,深圳,518055 |
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| 基金项目： | 广东省科技计划资助项目 |
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| 摘 要： | 在28℃.3.25A直流电下,对Cu/Sn3.0Ag0.5Cu/Cu对接无铅焊点进行原位电迁移实验,观察了通电120,168,384和504 h后焊点横截面的微观组织形貌.结果表明,电迁移初期,Cu<,6>Sn<,5>化合物遍布整个焊点截面,随时间延长,不断从阴极向阳极迁移聚集;当通电504 h后,焊点内已看不到金属间...
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| 关 键 词： | 原位电迁移 金属问化合物 Sn3.0Ag0.5Cu |
Intermetallic compound evolution induced by electromigration in situ for SnAgCu lead-free solder joint |
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| CHANG Hong,LI Mingyu.Intermetallic compound evolution induced by electromigration in situ for SnAgCu lead-free solder joint[J].Electronic Components & Materials,2011,30(3):58-60,68. |
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| Authors: | CHANG Hong LI Mingyu |
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| Affiliation: | (State Key Lab of Advanced Welding Production Technology,Shenzhen Graduate School of Harbin Institute of Technology,Shenzhen 518055,Guangdong Province,China) |
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| Abstract: | At 28 ℃ and direct current of 3.25 A,the electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu solder joint was investigated in situ.Micrographs of cross-section of joint were observed after current acting time of 120,168,384 and 504 h.Results show that Cu6Sn5 IMC spreads over all section of the joint in the early electromigration.As time goes on,IMC migrates from the cathode to the anode continuously.After current acting 504 h,there is no IMC inside solder joint,IMC layers is about 20 μm and 8 μm at the anode the cathode,respectively.The polarity effect appears at the interface obviously. |
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| Keywords: | Sn3 0Ag0 5Cu |
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