| 低温共烧陶瓷基板及其封装应用 |
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| 引用本文： | 龙乐. 低温共烧陶瓷基板及其封装应用[J]. 电子与封装, 2006, 6(11): 5-9 |
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| 作者姓名： | 龙乐 |
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| 作者单位： | 龙泉长柏路98号1栋208室,成都610100 |
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| 摘 要： | 低温共烧陶瓷LTCC基板是实现小型化、高可靠微波多芯片组件MMCM的一种理想的封装技术一文章对LTCC技术的特点及应用做出了评述,主要介绍国内外LTCC的现状、发展趋势与问题,同时突出强调了LTCC的飞速发展及对微波器件的重要性。
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| 关 键 词： | 低温共烧陶瓷 基板 封装 |
| 文章编号： | 1681-1070（2006）011-0005-05 |
| 收稿时间： | 2006-04-24 |
| 修稿时间： | 2006-04-24 |
LTCC Subatrate and its Packaging Applications |
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| LONG Le. LTCC Subatrate and its Packaging Applications[J]. Electronics & Packaging, 2006, 6(11): 5-9 |
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| Authors: | LONG Le |
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| Affiliation: | Changbai Road 98, 1-208, Longquan, Chengdu 610100, China |
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| Abstract: | Low temperature co-fired ceramics(LTCC)substrate is an excellent packaging technique for achieving highly reliable and miniature microwave modules(MMCM).The characteristics and applications of LTCC technology are reviewed.The current status,development trend and problems of LTCC are purposeful described at home and abroad.Meanwhile,from this article we can feel the LTCC is growing at a very fast speed and importance better microwave device. |
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| Keywords: | LTCC substrate packaging |
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