| LTCC接收前端组件的设计与实现 |
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| 引用本文： | 李中云,曾耿华,陈鹏,杨建宇.LTCC接收前端组件的设计与实现[J].电子科技大学学报（自然科学版）,2011,40(4):528-531. |
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| 作者姓名： | 李中云 曾耿华 陈鹏 杨建宇 |
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| 作者单位： | 1.中国工程物理研究院电子工程研究所 四川 绵阳 621900; |
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| 摘 要： | 低温共烧陶瓷(LTCC)多层基板技术是一种可实现微波电路小型化、高可靠性的新型技术.利用LTCC技术将功分器、耦合器、带通滤波器、电阻电容等接收前端主要无源元件埋置到基板内部,采用微组装技术实现芯片互连,实现了多芯片组装(MCM)级的S波段接收前端组件并进行了测试,测试结果表明接收前端达到设计指标,其体积仅相当于传统组...
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| 关 键 词： | 低温共烧陶瓷 多芯片组装 微组装 接收前端 |
| 收稿时间： | 2009-09-03 |
Design and Implementation of a LTCC-Based Receiver Front-End Module |
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| Affiliation: | 1.Institute of Electronic Engineering,China Academy of Engineering Physics Mianyang Sichuan 621900;2.School of Electronic Engineering,University of Electronic Science and Technology of China Chengdu 610054 |
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| Abstract: | Low temperature co-fired ceramic is a new technology for realizing microwave circuit with small size and high reliability. In this paper, using (LTCC) technology and micro-assembly technology, a receiver front-end in S-band is realized and tested. Results show that the receiver front-end realizes the design target. It has great advantages in volume and weight compared with traditional module when their circuit performance is equal. |
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