| Al2O3基板直接敷铜法的敷接机理研究 |
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| 引用本文： | 方志远,周和平,陈虎.Al2O3基板直接敷铜法的敷接机理研究[J].无机材料学报,2000,15(4):641-646. |
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| 作者姓名： | 方志远 周和平 陈虎 |
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| 作者单位： | 清华大学材料科学与工程系新型陶瓷与精细工艺国家重点实验室, 北崐京 100084 |
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| 摘 要： | 本文采用直接敷铜工艺，１０７０℃流动氮气氛下保温３ｈ制得当了强度达１１．５ｋｇ／ｃｍ＾２的直接铜ＡＩ２Ｏ３基板。介面产物ＣｕＡＩＯ２的形成是获得较高结合强度的关键，敷接温度下，在界面上产生了能很好润湿ＡＩ２Ｏ３表面的Ｃｕ〖Ｏ〗共晶液体，并反应生连续的ＣｕＡｌＯ２层降温时，共晶液体从Ｃｕ侧开始固化并淀析出ＣｕＯ２颗９粒，当固化前沿与ＣｕＡｌＯ２层相遇时，液相参与的界面反应停止，冷却至室温，即可获得Ｃ
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| 关 键 词： | 直接敷铜法 强度 三氧化二铝陶瓷基 敷接 |
| 文章编号： | 1000-324X(2000)04-0641-06 |
| 收稿时间： | 1999-7-22 |
| 修稿时间： | 1999年7月22日 |
Bonding Mechanism of Direct Bond Copper to Alumina Substrate |
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| FANG Zhi-yuan,ZHOU He-Ping,CHEN Hu.Bonding Mechanism of Direct Bond Copper to Alumina Substrate[J].Journal of Inorganic Materials,2000,15(4):641-646. |
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| Authors: | FANG Zhi-yuan ZHOU He-Ping CHEN Hu |
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| Affiliation: | StateKeyLaboratoryofNewCeramicsandFineProcessing;DepartmentofMaterialsScienceandEngineering;TsinghuaUniversityBeijing100084China |
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| Abstract: | Cu-Cu2O eutectic bonding of copper to Al2O3 was investigated. The highest peel strength was 11.5kg/cm for the specimen prepared at 1070C for 3h in nitrogen atmosphere. Oxygen promoted the wetting between copper and Al2O3 greatly. Cu［O］ melt reacted with the alumina and formed 奱 continuous CuAlO2 layer, which enhanced the peel strength of the joint. On cooling, the solidification front moved from the solid copper towards alumina, and Cu2O precipitated from the Cu［O］ melt. When the solidification front met the CuAlO2 layer, liquid-aided reaction completed and a reliable bond was achieved between the copper and Al2O3 substrate |
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| Keywords: | direct bonded copper(DBC) peel strength interfacial product |
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