QFN用环保塑封料研究

环氧塑封料是微电子工业和技术发展的基础材料,作为IC产品后道封装的三大主材料之一,随着IC封装技术的发展,对其特性的要求也越来越严格。IC产品未来发展趋势倾向于小体积高性能化的方向,QFN即为顺应此发展趋势所开发出来的封装形式。针对此封装形式长兴电子材料(昆山)有限公司开发出EK5600GH环保塑封料产品,此产品具有低吸湿率、低收缩率、高流动性及高可靠性的特点,可以满足QFN封装要求。同时还分别介绍了QFN用环保塑封料的测试数据、可靠性测试结果和客户端可靠性评估结果。

Research the Green Compound of QFN Package

Epoxy molding compound is the basic materials in microelectronics industrial and technological development,as one of the three main materials in the IC products molding process,with the development of IC packaging technology,its features have become increasingly stringent requirements.IC products tend to be small size in the direction of high-performance in the future,QFN shall conform to this trend of development,The green compound of EK5600GH were developed by Eternal Electronic Materials(Kunshan) Co.,Ltd...