Electrical Properties of Pre-Alloyed Cu-P Containing Electrically Conductive Adhesive |
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| Authors: | Li-Ngee Ho Teng Fei Wu Hiroshi Nishikawa Tadashi Takemoto |
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| Affiliation: | 1. Joining and Welding Research Institute , Osaka University , Ibaraki, Osaka, Japan;2. School of Materials Engineering , University Malaysia Perlis , Jejawi, Perlis, Malaysia holingee@yahoo.com;4. Graduate School of Engineering , Osaka University , Suita, Osaka, Japan;5. Joining and Welding Research Institute , Osaka University , Ibaraki, Osaka, Japan |
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| Abstract: | In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA was investigated for long-term stability and reliability by aging at high temperature exposure at 125°C and 85°C/85% RH for 1000 h, respectively. Results showed that the electrical resistivity of the Cu-P-filled ECA could be maintained consistently low after high temperature exposure at 125°C for 1000 h or aging at 85°C/85% RH for 1000 h, compared with the rapidly increased resistivity of Cu-filled ECA over time. A significantly low final resistivity at an order of magnitude of 10?4 Ω·cm could be maintained in Cu-P-filled ECA even after aging at 85°C/85% RH for 1000 h. |
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| Keywords: | Aging Copper and alloy Electrical properties Phenolic |
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