The Effect of Cure Conditions on a Rubber-Modified Epoxy Adhesive |
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| Authors: | S. J. Shaw D. A. Tod |
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| Affiliation: | 1. Ministry of Defence , Royal Armament Research &2. Development Establishment , Waltham, Abbey , Essex , UK |
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| Abstract: | The effect of cure conditions on the mechanical properties of a piperidine-cured, rubber-modified epoxy is described. The results obtained reveal that variations in cure conditions (temperature and time) have a pronounced influence on the mechanical behaviour, in particular the fracture energy obtained in both bulk and adhesive joint form. Techniques such as dynamic mechanical spectroscopy and scanning electron microscopy have been employed in an attempt to explain the trends. |
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| Keywords: | Piperidine cure mechanical properties fracture toughness cure conditions dynamic mechanical spectroscopy scanning electron microscopy |
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