| 锡晶须形成的影响因素研究 |
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| 引用本文： | 曾续武.锡晶须形成的影响因素研究[J].新技术新工艺,2009(3):108-109. |
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| 作者姓名： | 曾续武 |
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| 作者单位： | 许昌烟草机械有限责任公司,河南,许昌,461000 |
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| 摘 要： | 用电镀方法制备锡锰合金镀层，用扫描电镜观察其表面自然生长的晶须，分析基体表面粗糙度、搅拌、电流密度参数等对晶须生长的影响。结果表明，增大电流密度可提高晶须密度，这与镀层结晶组织密切相关。
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| 关 键 词： | 锡晶须 电镀 结晶组织 |
Study of Influencing Factors for Tin Whisker Forming |
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| ZENG Xuwu.Study of Influencing Factors for Tin Whisker Forming[J].New Technology & New Process,2009(3):108-109. |
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| Authors: | ZENG Xuwu |
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| Affiliation: | ZENG Xuwu (Xuchang Cigarette Machine Limited Corporation, Xuchang 461000,China) |
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| Abstract: | Sn-Mn alloy cladding is prepared by the plating method. The whiskers on the surface of wild steel are observed by SEM and the influencing factors of surface roughness, agitation as well as current density parameters are analyzed. The results show that the whisker density can be increased through increased current density which is related to crystal structure of cladding. |
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| Keywords: | Tin whisker Plating Crystal structure |
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