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聚乙烯基三苯乙炔基硅烷的制备及热性能分析
引用本文:谭德新,王艳丽,邢宏龙,唐玲,史铁钧.聚乙烯基三苯乙炔基硅烷的制备及热性能分析[J].材料科学与工艺,2015,23(2):63-67.
作者姓名:谭德新  王艳丽  邢宏龙  唐玲  史铁钧
作者单位:1. 安徽理工大学 化工学院,安徽 淮南,232001;2. 安徽理工大学 材料科学与工程学院,安徽 淮南,232001;3. 合肥工业大学 化工学院,合肥,230009
基金项目:国家自然科学基金资助项目(2,5);安徽省高校自然科学基金重点项目(KJ2013A087, KJ2013A095);安徽理工大学博士基金项目.
摘    要:为研究聚乙烯基三苯乙炔基硅烷树脂的热性能,以苯乙炔和乙烯基三氯硅烷为原料,运用格利雅反应合成了乙烯基三苯乙炔基硅烷单体,并通过红外(FT-IR)、核磁(1H-NMR,13C-NMR,29Si-NMR)证实了合成产物.以此单体为原料,通过热聚合法制备了聚乙烯基三苯乙炔基硅烷树脂,并采用TGA-DTG研究该聚合物的热分解动力学,计算了相应动力学参数.结果表明:该树脂的热分解温度(Td5%)在550℃左右,800℃时聚合物的残炭率约80%;用Kissinger法和Ozawa法求得的聚合物热分解活化能分别为266.55和236.89 k J/mol;用Crane法求得聚合物的热分解反应级数为0.93,近似为一级反应.

关 键 词:苯乙炔  乙烯基三氯硅烷  格利雅反应  乙烯基三苯乙炔基硅烷  热分解动力学
收稿时间:2014/4/17 0:00:00

Preparation and thermal properties of polyvinyl(triphenylethynyl)silane
TAN Dexin,WANG Yanli,XING Honglong,TANG Ling and SHI Tiejun.Preparation and thermal properties of polyvinyl(triphenylethynyl)silane[J].Materials Science and Technology,2015,23(2):63-67.
Authors:TAN Dexin  WANG Yanli  XING Honglong  TANG Ling and SHI Tiejun
Affiliation:School of Chemical Engineering, Anhui University of Science and Technology, Huainan 232001, China,School of Materials Science and Engineering, Anhui University of Science and Technology, Huainan 232001, China,School of Chemical Engineering, Anhui University of Science and Technology, Huainan 232001, China,School of Chemical Engineering, Anhui University of Science and Technology, Huainan 232001, China and School of Chemical Engineering, Hefei University of Technology, Hefei 230009, China
Abstract:To investigate the thermal properties of poly ( vinyltri ( phenylethynyl ) silane ) s ( PVTPES ) , vinyltri (phenylethynyl)silane (( Ph C?C )3—Si—CH?CH2 )(VTPES)was synthesized with vinyltrichlorosilane and phenylethynyl by Grignard reaction. Fourier transform infrared ( FT-IR ) and nuclear magnetic resonance (1H-NMR, 13C-NMR, 29Si-NMR) were used to characterize the molecular structure. Polymer of poly (vinyltri( phenylethynyl) silane) s was prepared by thermal polymerization of VTPES monomer and further characterized by TGA-DTG to get the corresponding thermal decomposition kinetic parameters. The results showed that the decomposition temperature at 5% weight loss ( Td5%) of the resin was about 550℃, and char yield (800 ℃) was approximately 80%. The Ea were 266.55 kJ/mol and 236.89 kJ/mol by Kissinger and Ozawa methods, respectively;the reaction order was 0.93 by Crane equation suggesting that the decomposition reaction was the first order reaction.
Keywords:phenylethynylene  vinyltrichlorosilane  grignard reaction  vinyltri(phenylethynyl)silane  thermal decomposition kinetics
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