| 导热电子灌封硅橡胶的研究进展 |
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| 引用本文： | 吴敏娟,周玲娟,江国栋,王庭慰.导热电子灌封硅橡胶的研究进展[J].有机硅材料,2006,20(2):81-85. |
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| 作者姓名： | 吴敏娟 周玲娟 江国栋 王庭慰 |
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| 作者单位： | 南京工业大学材料科学与工程学院,南京,21009 |
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| 摘 要： | 概述了导热电子灌封硅橡胶的研究背景。综述了导热电子灌封硅橡胶的组成,提高导热电子灌封硅橡胶导热性的途径及灌封工艺,灌封中常见的问题及改进措施,灌封材料的性能要求等,对导热电子灌封硅橡胶未来的研究方向进行了展望。
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| 关 键 词： | 导热 灌封 有机硅 硅橡胶 |
| 文章编号： | 1009-4369（2006）02-0081-05 |
| 收稿时间： | 2006-01-06 |
| 修稿时间： | 2006年1月6日 |
Research on liquid thermally conductive silicone rubber |
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| WU Min-juan,ZHOU Ling-juan,JIANG Guo-dong,WANG Ting-wei.Research on liquid thermally conductive silicone rubber[J].Silicone Material,2006,20(2):81-85. |
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| Authors: | WU Min-juan ZHOU Ling-juan JIANG Guo-dong WANG Ting-wei |
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| Abstract: | The research background of the liquid thermal conductive encapsulated silicone rubber was summarized.It was introduced that the composition of the thermal conductive encapsulated silicone rubber,the approach of improving the heat conductivity of thermal conductive encapsulated silicone rubber and its encapsulation technology,the required performance of the pouring material,as well as the common problems and the improvement in the encapsulation.At last,the future of heat conductive silicone rubber was forecasted. |
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| Keywords: | thermal conductive coefficient insulation pouring material silicone silicone rubber |
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