| BGA封装技术 |
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| 引用本文： | 杨兵,刘颖. BGA封装技术[J]. 电子与封装, 2003, 3(4): 6-13,27 |
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| 作者姓名： | 杨兵 刘颖 |
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| 作者单位： | 中国电子科技集团公司第58研究所,江苏,无锡,214035 |
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| 摘 要： | 本文简述了BGA封装产品的特点、结构以及一些BGA产品的封装工艺流程,对BGA封装中芯片和基板两种互连方法——引线键合/倒装焊键合进行了比较以及对几种常规BGA封装的成本/性能的比较,并介绍了BGA产品的可靠性。另外,还对开发我国BGA封装技术提出了建议。
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| 关 键 词： | BGA 结构 基板 引线键合 倒装焊键合 |
| 修稿时间： | 2003-04-05 |
BGA Packaging Technology |
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| YANG Bing,LIU Ying. BGA Packaging Technology[J]. Electronics & Packaging, 2003, 3(4): 6-13,27 |
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| Authors: | YANG Bing LIU Ying |
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| Abstract: | This paper discusses the characteristics, types and process of BGA technology. Wire bond and flip chip,which are the two methods used for chip connection in BGA, are discussed. The cost to property ratio of several conventional BGA is discussed and the reliability of BGA products in also introduced. Some advices on how to develop BGA technology in our country are postulated in the end of the article. |
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| Keywords: | BGA Structure Substrate Wire bond Flip chip |
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