Gate oxide punching thru mechanism in plasma dry etching

The punching thru mechanism of gate oxide (thickness about 15A) was investigated. Because of the thin thickness of gate oxide, gate oxide punching thru may easily happen during the plasma process. It was found that what caused the punching thru was not only the selectivity of poly-silicon/oxide but also the pattern topography. We used the basic SRAM pattern to check this topography effect, and found that gate oxide located at the narrow spacing of two parallel serpentine lines was the most easily punched thru. What caused the topography effect was the starvation of oxygen in these places which were induced by the residue of poly-silicon and enhanced by electron shading effect. So, to solve the issue of gate oxide punching thru, firstly the selectivity should be enough, secondly we should pay attention to the etching pattern topography. Supported by the National High-Tech Research and Development Program of China (“863” Project) (Grant No. 2006AA843134) and the National Basic Research Program of China ("973" Project) (Grant No. 2007CB935302)