| 集成电路封装用MC型环氧模塑料的研制 |
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| 引用本文： | 周煜明. 集成电路封装用MC型环氧模塑料的研制[J]. 热固性树脂, 1993, 0(3) |
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| 作者姓名： | 周煜明 |
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| 作者单位： | 无锡化工研究设计院 |
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| 摘 要： | 本文涉及集成电路封装用环氧模塑料的基本配方和制造方法,讨论了环氧模塑料各组分的作用及其对模塑料性能的影响,尤其是对用它封装的半导体器件的耐湿可靠性的影响.
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PREPARATION OF TYPE MC EPOXY RESIN MOULDING COMPOUND FOR ENCAPSULATING OF IC |
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| Abstract: | The basic formulae and manufecturing method of epoxy resin moulding compounds for encapsulating IC are described, and the function of various componets of the compounds and their effect on the properties of the compounds, especially on the moisture resistance of the encapsulated semiconductor elements, were discussed. |
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