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碱性抛光液中氧化剂的钝化作用对碟形坑的影响
引用本文:贾少华,刘玉岭,王辰伟,闫辰奇. 碱性抛光液中氧化剂的钝化作用对碟形坑的影响[J]. 半导体学报, 2015, 36(12): 126002-4. DOI: 10.1088/1674-4926/36/12/126002
作者姓名:贾少华  刘玉岭  王辰伟  闫辰奇
基金项目:Project supported by the Special Project Items No.2 in National Long-Term Technology Development Plan, China
摘    要:摘要:本文研究了碱性精抛液的电化学行为。主要研究内容为不同H2O2浓度电解液中腐蚀电位(Ecorr)和腐蚀电流(Icorr)的变化规律,对比了不同精抛电解液的极化曲线,分析了H2O2的钝化作用对控制碟形坑的影响。结果表明:在电化学实验过程中,随着H2O2浓度的增加,腐蚀电位逐渐增加然后趋于平缓,相反腐蚀电流逐渐减小。同时,精抛后的碟形坑随着H2O2浓度的增加而减小,平坦化效果得到了优化。

关 键 词:hydrogen peroxide  passivation  dishing  alkaline  Cu CMP

Influence of oxidant passivation on controlling dishing in alkaline chemical mechanical planarization
Jia Shaohu,Liu Yuling,Wang Chenwei and Yan Chenqi. Influence of oxidant passivation on controlling dishing in alkaline chemical mechanical planarization[J]. Chinese Journal of Semiconductors, 2015, 36(12): 126002-4. DOI: 10.1088/1674-4926/36/12/126002
Authors:Jia Shaohu  Liu Yuling  Wang Chenwei  Yan Chenqi
Affiliation:Institute of Microelectronics,Hebei University of Technology,Tianjin 300130,China
Abstract:The article studied the electrochemical behavior of P2 alkaline polishing slurry. The main research is the changing discipline of Ecorr and Icorr in the Cu electrolyte at different concentrations of oxidant H2O2. It compares potentiodynamic polarization curves in different P2 slurries and analyzes the passivation function of H2O2 acting on controlling dishing. The result implies that the potential increases gradually and then levels off while the current density on the contrary decreases with the augment of H2O2 concentration. In addition, dishing declines with the increasing of H2O2 along with the optimization of planarization of the alkaline P2 slurry.
Keywords:hydrogen peroxide  passivation  dishing  alkaline  Cu CMP
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