Electronic packaging materials prepared by powder injecting molding and pressure infiltration process |
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| Authors: | YIN Fazhang GUO Hong JIA Chengchang XU Jun ZHANG Ximin ZHU Xuexin |
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| Affiliation: | 1. National Engineering and Technology Research Center for Nonferrous Metals Composites, Beijing General Research Institute for Nonferrous Metals, Beijing 100088, China
2. Materials Science and Engineering School, University of Science and Technology Beijing, Beijing 100083, China |
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| Abstract: | AlSiCp (65 vol.% SiC) electronic packaging materials were manufactured by powder injection molding (PIM) and pressure infiltration process in order to obtain near net-shaped parts. SiCp preformed compacts obtained by pre-sintering process at 1150 K have high strength and good appearance, and the ratio of open porosity to total porosity is nearly 98%. The relative density of composites is bigger than 99%. The thermal conductivity of AlSiCp composites fabricated by this method is 198 W.m?1.K?1, and the coefficient of thermal expansion (CTE) is 8.0 x 10?6/K (298 K). |
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| Keywords: | composites aluminum microstructure thermal conductivity |
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