| 化学镀可焊性锡基合金的研究进展 |
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| 引用本文： | 赵国鹏,樊江莉,温青. 化学镀可焊性锡基合金的研究进展[J]. 电镀与涂饰, 2001, 20(1): 46-49 |
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| 作者姓名： | 赵国鹏 樊江莉 温青 |
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| 作者单位： | 1. 广州二轻工业科学技术研究所,
2. 鞍山钢铁学院 化学工程学院, |
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| 摘 要： | 本文综述了近 1 0年来化学镀可焊性锡基合金的研究现状及动态。列举了 4种不同镀液体系的典型配方及工艺 ,并对化学镀锡合金的未来发展提出了建议
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| 关 键 词： | 化学镀 可焊性 锡基合金 |
| 文章编号： | 1001-227X(2001)01-0046-04 |
| 修稿时间： | 2000-12-01 |
Progress of research on electroless plating of solderable tin alloy |
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| ZHAO Guo-peng,FAN Jiang-li,WEN Qing. Progress of research on electroless plating of solderable tin alloy[J]. Electroplating & Finishing, 2001, 20(1): 46-49 |
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| Authors: | ZHAO Guo-peng FAN Jiang-li WEN Qing |
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| Affiliation: | ZHAO Guo-peng 1,FAN Jiang-li 2,WEN Qing 1 |
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| Abstract: | Current status and prospect of solderable electroless tin alloy plating were summarized with 18 references published in the recent decade. Four traditional plating solutions based on chloride, fluoboric, alkyl sulfonate and ethane sulfonate were exemplified. Suggestions were presented about the develoment of electroless plating of solderable tin alloy. |
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| Keywords: | electroless plating solderable tin based alloy |
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