Concept for diamond 3-D integrated UV sensor

In this investigation we present a novel technology for three-dimensional integration of diamond sensors and actuators. Based on a previously developed technology for the integration of a 3-D CMOS camera stack, in this attempt nano-crystalline diamond layers on silicon are used at the sensor level. The processing steps involve silicon thinning, through-silicon etching and metallization, as well as a soldering process using inter-metallic diffusion. Strong emphasis lies on a low thermal budget process, making the technology suitable for backend processing. The concept is demonstrated, however active CMOS chips are not yet implemented. First electrical measurements of the through-connected UV sensors are presented.