锗片的高速机械化学研磨工艺研究

锗在红外光学系统和半导体器件制造中应用广泛,在实际应用中对锗片的表面质量如粗糙度、平面度和亚表面层破坏深度等要求较高,一般需要通过研磨和抛光的加工工艺才能实现。为达到对锗片高效和高质量机械化学研磨,首先分析了锗片高速研磨原理,并建立了相应的数学模型;然后通过实验研究了研磨压力、主轴转速、磨料成分和粒度,以及材料去除速率等因素对研磨效果的影响;最后,提出了以提高加工效率和加工质量为目的的机械化学研磨加工策略。

The study of high speed mechanochemical lapping technology for germanium wafer

Germanium was widely used in infrared optical systems and semiconductor fabrication industry,the requirements of the surface quality such as roughness,planeness and destroyed deepness in the subsurface were very high,these requirements mainly were realized by the method of lapping or polishing.In order to lap the germanium with high efficiency and quality,the high speed lapping theory was analyzed and the according math model was setup,then the effect on the germanium wafer from the parameters of lapping stress,shaft rotating speed,abrasive composition and size,material removing rate were studied,and a high speed mechanochemical lapping technology was given.