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光敏树脂固化硬度的优化研究
引用本文:白皛,赵罘,辛洪兵.光敏树脂固化硬度的优化研究[J].包装工程,2009(10).
作者姓名:白皛  赵罘  辛洪兵
作者单位:北京工商大学;
基金项目:北京市教委科技发展计划项目(KM200810011001)
摘    要:综合利用正交试验和递归神经网络的方法,研究了光敏树脂SZ-01在光固化成形后表面硬度随着环境温度、光照距离及光照时间的变化规律,并利用遗传优化设计的方法,找到了一组合理的工艺参数组合,使得光敏树脂固化后的表面硬度达到最大。

关 键 词:光敏树脂  固化硬度  正交试验  神经网络  遗传优化  

Optimum Design of Curing Hardness of Photosensitive Resin
BAI Qiao,ZHAO Fu,XIN Hong-bing.Optimum Design of Curing Hardness of Photosensitive Resin[J].Packaging Engineering,2009(10).
Authors:BAI Qiao  ZHAO Fu  XIN Hong-bing
Affiliation:BAI Qiao,ZHAO Fu,XIN Hong-bing (Beijing Technology , Business University,Beijing 100048,China)
Abstract:The changing rule of the hardness of SZ-01 photosensitive resin surface after curing with temperature,illumination distance,and illumination time was studied with orthogonal experiment and recurrent neural network methods.A group of reasonable technique parameters were found with genetic algorithm optimization,which can make the hardness of photosensitive resin after curing the highest.
Keywords:photosensitive resin  curing hardness  orthogonal experiment  neural network  genetic algorithm  
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