| Abstract: | New bismaleimides containing ether bonds were prepared. The thermal properties of the bismaleimides were investigated by differential scanning calorimetry (DSC). The effects of structure of the bismaleimides and curing conditions on the thermal and mechanical properties of the cured resins such as initial decomposition temperature (Td), glass transition temperature (Tg), and flexural strength were studied. The introduction of ether bonds to bismaleimide resins decreased the brittleness of the resins without reductions in their heat-resistant properties. |
