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| 绿色环保无卤阻燃环氧塑封料的研究与发展 | |
| 引用本文： | 宋涛,李志生,封其立,王超,刘金刚,杨士勇. 绿色环保无卤阻燃环氧塑封料的研究与发展[J]. 电子与封装, 2012, 12(1): 1-6 |
| 作者姓名： | 宋涛 李志生 封其立 王超 刘金刚 杨士勇 |
| 作者单位： | 1. 中国科学院化学研究所高技术材料实验室,北京,100190 2. 江苏中鹏新材料股份有限公司,江苏连云港,222062 3. 山东省菜成市科盛化工有限公司,江苏威海,264309 |
| 基金项目： | 科技部02专项资助课题（课题编号：2009ZX01010-007） |
| 摘 要： | 随着先进集成电路封装技术的快速发展以及全球环境保护呼声的日益高涨,绿色环保无卤阻燃环氧塑封料得到了越来越广泛的重视。文章综述了近年来国内外在绿色无卤阻燃环保塑封料研究与开发领域内的最新进展。分别介绍了均聚型、共聚型以及含氟苯酚-芳烷基型酚醛树脂固化剂、环氧树脂以及塑封料的阻燃机制、研究现状以及发展趋势。同时介绍了中国科学院化学研究所在相关领域内的研究进展情况,最后对我国绿色环保塑封料产业的发展前景进行了展望。 |
| 关 键 词： | 环氧塑封料 酚醛树脂 苯酚-芳烷基 无卤阻燃 |
Research and Development of Halogen Free Flame Retardant Epoxy Molding Compounds |
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| SONG Tao,LI Zhi-sheng,FENG Qi-li,WANG Chao,LIU Jin-gang,YANG Shi-yong. Research and Development of Halogen Free Flame Retardant Epoxy Molding Compounds[J]. Electronics & Packaging, 2012, 12(1): 1-6 | |
| Authors: | SONG Tao LI Zhi-sheng FENG Qi-li WANG Chao LIU Jin-gang YANG Shi-yong |
| Affiliation: | 1 ( 1. Laboratory of AdvancedPolymer Materials, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China;2. Jiang Su Zhongpeng Sinopaco Co., Ltd, Lianyungang 222062, China; 3. Rongcheng K＆S Chemical Co., Ltd, Weihai 264309, China) |
| Abstract: | With the rapid development of advanced microelectronic packaging and the ever-rising demands of global environmental protection, halogen-free flame retardant epoxy molding compounds （EMCs） have been paid much attention in recent years. Recent research and development of halogen free flame retardant EMCs have been reviewed in the present work. The homo-polymerized, copolymerized and fluorinated phenol-aralkyl phenolic resin hardener, epoxy, and EMC were separately summarized. The present status of green EMCs studies in 1CCAS was also introduced. Finally, the future developing trends of green EMC industry in China are prospected. |
| Keywords: | epoxy molding compound phenolic resin phenol-aralkyl halogen-flee retardant |
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